Radiance is a flexible tool with cluster architecture for substrate sizes up to 12 inch with process modules  based around a central transport module with vacuum cassette elevator, robot and load lock.  .   Choose from PVD, PECVD, ICP, RIE, Microwave, Soft Etch and RTP technologies  according to your process and metrology options including broadband optical monitoring to configure your tool for optics, optoelectronics or semiconductor.

Configure your Radiance

Step 1: Choose your handler- from single sided manual loadlock to 8 sided fully automated

Step 2: Chose from direct wafer handling or substrate carriers

Step 3: Select process modules- single , batch and combinations

Step 4: Configure process hardware- deposition, etch or layer conditioning

Step 5: Choose control  & metrology-  eg Pyrometry, Stress Control, Optical Monitoring