The BAP801 is a dedicated low voltage ion plating system where evaporant material, plasma source working gas and reactive gas atoms are all ionized and activated into a highly energetic state. The kinetic energy of the vapour beam under such condition sis typically 10-50eV, some 2 to 3 orders of magnitude higher than in conventional evaporation processes. Films formed under such conditions have near theoretical densities and exhibit excellent mechanical, optical and environmental stability. The system is ideal for deposition of oxides and nitrides. Sophisticated process control enables precise control of film stress and behaviour opening up entirely new possibilities for thin film design.

Typical applications include fibre optics, optoelectronics and photonics.

The BAP801 is based on the BAK761 platform with the proprietary plasma source mounted at the front and ideal for volume production of thin film stacks with the most demanding specifications.